IMI USA, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9839142 Vacuum pallet reflowAug 06, 15Dec 05, 17[B23K, H05K]
6846701 Traceless flip chip assembly and methodApr 11, 03Jan 25, 05[H01L]
6776859 Anisotropic bonding system and method using dynamic feedbackNov 27, 00Aug 17, 04[B32B]
6648213 Manufacturing method for attaching components to a substrateMar 05, 01Nov 18, 03[H01L, B23K]
6571468 Traceless flip chip assembly and methodFeb 26, 01Jun 03, 03[H01K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0075,850 FLIP-CHIP BONDED IMAGER DIEAbandonedAug 20, 12Mar 28, 13[H01L]
2012/0273,559 VACUUM PALLET REFLOWAbandonedApr 27, 12Nov 01, 12[B23K]

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